Microlithography of hole transport layers for high-resolution organic light-emitting diodes with reduced electrical crosstalk
PubDate: Jan 2025
Teams:Stanford University;Yonsei University;Sogang University;Hanyang University
Writers: Hyukmin Kweon, Seonkwon Kim, Borina Ha, Seunghan Lee, Soyeon Lee, SeungHwan Roh, Hayoung Oh, Jiyeon Ha, Minsu Kang, Moon Sung Kang, Jeong Ho Cho & Do Hwan Kim
Abstract
High-density displays are required for the development of virtual and augmented reality devices. However, increasing the pixel resolution can lead to higher electrical pixel crosstalk, primarily due to a shared hole transport layer. Here we show that a silicone-integrated small-molecule hole transport layer can be patterned at the wafer scale with microlithography to mitigate electrical pixel crosstalk. This provides high-density pixelation and improved performance of the hole transport layer itself. With this approach, we create high-fidelity micro-pattern arrays with a resolution of up to 10,062 pixels per inch on a six-inch wafer. The silicone-integrated small-molecule hole transport layer can effectively modulate charge balance within the emission layers, improving the luminance characteristics of organic light-emitting diodes. We also show that organic light-emitting diodes integrated with micro-patterned silicone-integrated small-molecule hole transport layers have a reduced electrical pixel crosstalk compared with organic light-emitting diodes with a typical hole transport layer.